Tris(dimethylamido)aluminum(III) and N2H4: Ideal precursors for the low-temperature deposition of large grain, oriented c-axis AlN on Si via atomic layer annealing

  1. Ueda, S.T.
  2. McLeod, A.
  3. Alvarez, D.
  4. Moser, D.
  5. Kanjolia, R.
  6. Moinpour, M.
  7. Woodruff, J.
  8. Kummel, A.C.
Zeitschrift:
Applied Surface Science

ISSN: 0169-4332

Datum der Publikation: 2021

Ausgabe: 554

Art: Artikel

DOI: 10.1016/J.APSUSC.2021.149656 GOOGLE SCHOLAR