Thermal Characterization of Multichip Power Module

  1. Hernando, F.G.
  2. Sebastian, J.S.
  3. Arias, M.
  4. Rujas, A.
Proceedings:
2018 20th European Conference on Power Electronics and Applications, EPE 2018 ECCE Europe

ISBN: 9789075815283

Year of publication: 2018

Type: Conference paper

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Data source: Scopus