Thermal Characterization of Multichip Power Module
- Hernando, F.G.
- Sebastian, J.S.
- Arias, M.
- Rujas, A.
Konferenzberichte:
2018 20th European Conference on Power Electronics and Applications, EPE 2018 ECCE Europe
ISBN: 9789075815283
Datum der Publikation: 2018
Art: Konferenz-Beitrag