INGENIERÍA DE COMPUTADORES (PROVISIONAL)
ICOM
![Foto de INGENIERÍA DE COMPUTADORES (PROVISIONAL)](/img/grupo.png)
![Foto de Tomsk Polytechnic University](/img/noimage_org.png)
Tomsk Polytechnic University
Tomsk, RusiaPublicaciones en colaboración con investigadores/as de Tomsk Polytechnic University (2)
2024
-
Contactless and nondestructive evaluation of residual stress distribution in modified and pure HDPE materials using a novel terahertz method and line-scan thermographic technique
Composites Part A: Applied Science and Manufacturing, Vol. 183
-
Enhancing resistance to low-velocity impact of electrospun-manufactured interlayer-strengthened CFRP by using infrared thermography
NDT and E International, Vol. 144