Vapor-phase surface cleaning of electroplated Cu films using anhydrous N2H4

1. Hwang, S.M.
2. Peña, L.F.
3. Tan, K.
4. Kim, H.S.
5. Kondusamy, A.L.N.
6. Qin, Z.
7. Jung, Y.C.
8. Veyan, J.-F.
9. Alvarez, D.
10. Spiegelman, J.
11. Kim, J.