ICOM
Ingeniería de Computadores
Publications (3)
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Condensed Matter Physics
2025
2024
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Contactless and nondestructive evaluation of residual stress distribution in modified and pure HDPE materials using a novel terahertz method and line-scan thermographic technique
Composites Part A: Applied Science and Manufacturing, Vol. 183
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Enhancing resistance to low-velocity impact of electrospun-manufactured interlayer-strengthened CFRP by using infrared thermography
NDT and E International, Vol. 144